top of page
BGA repair machine

The Model 9400 BGA Solder Sphere Placement System ensures precise placement of solder spheres with a vacuum system for accurate alignment. It's ideal for low-volume manufacturing, rework, and prototyping, supporting various BGA layouts. It's easy to use and requires minimal training. Setup is quick and adaptable.

HEPCO Model 9400-1

BGA Reballing

BGA circuit board
BGA circuit board
bottom of page