HEPCO Model 9400-1
The Model 9400 BGA Solder Sphere Placement System ensures precise placement of solder spheres with a vacuum system for accurate alignment. It's ideal for low-volume manufacturing, rework, and prototyping, supporting various BGA layouts. It's easy to use and requires minimal training. Setup is quick and adaptable.
BGA Solder Sphere Placement
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The Model 9400 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array.
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Alignment is achieved through precision pins and specific tooling for ease of use, repeatability, and accuracy in sphere placement.
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Repeatable process control to insure co-planarity and uniformity.
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Fits virtually all BGA layouts and sphere sizes.
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Self-contained system, no additional air/vacuum required.
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Ideal for Lower Volume Manufacturers, Rework, and Prototyping.
BGA Solder Sphere Placement System
PROCESS
1.
Place component in alignment plate.
2.
Turn vacuum on.
3.
Remove residual solder and/or contaminates.
4.
Print flux on the component using appropriate stencil.
6.
Load wand with sphere's using vacuum pick-up.
7.
Align Wand using tooling pins.
8.
Depress foot pedal to release the full array of sphere's.
9.
Lift block.
Additional KIT setups
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Single or multiple component capabilities.
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Custom tooling available.
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Complete set-up achieved in seconds!
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Very minimal operator training necessary.
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Send your drawing or a sample to HEPCO's Engineers
CONTACT YOUR SALES REP FOR A DEMO TODAY!
HEPCO, INC.
Phone:(408) 738-1880 - Fax:(408) 732-4456
info@hepcoblue.com
Legends Manufacturing Solutions
Phone:(630) 520-5542
Ralphingraffia@gmail.com