MODEL 9400-1 : HEPCO, Inc.

MODEL 9400-1
BGA Solder Sphere Placement System

BGA Solder Sphere Placement System

The Model 9400 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array.
Alignment is achieved through precision pins and specific tooling for ease of use, repeatability, and accuracy in sphere placement.
"Black Contrast" for easy visual inspection or arrays.
Repeatable process control to insure co-planarity and uniformity.
Fits virtually all BGA layouts and sphere sizes.
Self-contained system, no additional air/vacuum required.
Ideal for Lower Volume Manufacturers, Rework, and Prototyping.
PROCESS:
Click here to download step-by-step directions with pictures.
Click here to stream Video Demo! (Requires Windows Media Player & Broadband Connection)
Click here to download our .pdf flyer (Requires Adobe Acrobat Reader)
Place component in alignment plate.
Turn vacuum on.
Remove residual solder and/or contaminates.
Print flux on the component using appropriate stencil.
Load wand with sphere's using vacuum pick-up.
Align Wand using tooling pins.
Depress foot pedal to release the full array of sphere's.
Lift block.
Remove component from carrier.
Reflow the part using proper profile.

Additional KIT setups

Single or multiple component capabilities.
Custom tooling available.
Complete set-up achieved in seconds!
Very minimal operator training necessary.
Send your drawing or a sample to HEPCO's Engineers
Features of the system are included in several Patents Pending and Trademarks

CONTACT YOUR SALES REP FOR A DEMO TODAY!
For more information: HEPCO, INC.
Phone:(408) 738-1880 - Fax:(408) 732-4456
http://www.hepcoblue.com -or- info@hepcoblue.com